Analysis of thermal behavior and mass transport for manufacturing deep-small hole by ultra-high frequency induction-assisted laser wire deposition

Synchronous ultra-high frequency (UHF) induction-assisted laser deposition is an effective approach to tackle the extreme heat input and common defects that originate from laser direct deposition. The added auxiliary induction heat source can reduce the energy input of the laser heat source which guarantees the geometric integrity of the embedded tube and decreases temperature gradient. Meanwhile, the effective preheating of the induction heat source assures the metallurgical bonding among the substrate, deposited track and embedded tube. Experiments showed that the effective bonding can be formed among substrate-deposited track and deposited track- embedded tube under suitable combination parameters of the laser heat and induction heat. To gain insight into the hybrid deposition, a 3D numerical model coupled with multi-physical fields was established to explore the thermal process and flow behavior with assistance of induction heat. Results indicated that the electromagnetic force produced by induction coil promotes the flow velocity, which increases heat convection. Investigation on the induction heat parameter demonstrated that raising current intensity can accelerate the flow velocity from 0.07 m s(-1) to 0.09 m s(-1) while the maximum temperature of the molten pool declined from 2610 K to 2440 K owing to the reinforced heat convection. The experimental cross-section of the deposited tracks and the detected element distribution in transition areas are well tested against the numerical simulation results. The grain size in the top region of the deposited track is refined with increasing current intensity, which is experimentally and numerically verified by observed microstructure and G*R value. Meanwhile, the fabricated deposited track with average friction coefficient of 0.445 can be obtained when the laser and induction parameters are 1000 W and 400A, respectively.