Effect of Ni-RGO nanosheets on the creep behavior of Sn-Ag-Cu composite solder joints

Creep damage of Sn-Ag-Cu micro-joints is inevitable in service, even at room temperature. In this study, Nidecorated reduced graphene oxide (Ni-RGO) nanosheets were rationally selected as a promising reinforcement in Sn-3.0Ag-0.5Cu (SAC305) solder to improve creep resistance. Tensile creep tests were conducted on the NiRGO reinforced SAC305 micro-joints under 8-14 MPa stress at 100-150 degrees C by dynamic mechanical analysis (DMA) equipment. Micrography and fractography were observed using FESEM. The stress exponent (n) increased from 5.83 to 6.37, and the activation energy (Q) rose from 68.80 to 75.41 kJ/mol as 0.10 wt% Ni-RGO nano- sheets were added into the SAC305 solder, indicating the occurrence of diffusion mechanism. By adding a trace amount of Ni-RGO nanosheets (no more than 0.10 wt%), the crack initiation was prone to occur at the wave- valley of the continuous scallop shaped interface, where the diffusion of vacancies occurred, resulting in hybrid-fracture features of quasi-cleavage and dimples. It can be concluded that the inclusion of trace amounts of Ni-RGO nanosheets can enhance the creep resistance of SAC305 micro-joints during service.