A 140-and 220-GHz Dual-Band Amplifier in 130-nm SiGe BiCMOS Process

被引:0
|
作者
Guo, Letian [1 ]
Li, Shuyang [2 ]
Chen, Wenhua [2 ]
Ma, Shunli [1 ]
Ren, Junyan [1 ]
机构
[1] Fudan Univ, State Key Lab Integrated Chips & Syst, Shanghai 200433, Peoples R China
[2] Tsinghua Univ, Dept Elect Engn, Beijing 100084, Peoples R China
基金
中国国家自然科学基金; 上海市自然科学基金;
关键词
Dual band; Transistors; Power amplifiers; Power generation; Impedance; Stability analysis; Layout; Dual-band; power amplifier; SiGe BiCMOS process; stacked BJT; three-conductor balun; POWER-AMPLIFIER; DESIGN; GAIN;
D O I
10.1109/TTHZ.2024.3430064
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This article presents a concurrent dual-band power amplifier (PA) in 130-nm SiGe BiCMOS process. A three-stage stacked BJT amplifier configuration is employed to enhance both the power gain and the output power. To achieve dual-band low-loss matching, the subquarter-wavelength-based baluns are adopted to construct the input and output matching networks. In addition, multiorder LC networks are introduced to achieve excellent dual-band interstage impedance matching. The proposed three-stage dual-band PA exhibits maximum small signal gains of 25.4 dB at 135 GHz and 21.6 dB at 210 GHz, with 3-dB bandwidths of 28 and 25 GHz, respectively. The measured results show a saturated power (Psat) of more than 13.1 dBm and 9.6 dBm and a power-added efficiency (PAE) of more than 6.75% and 3.1% over ranges of 126-154 GHz and 200-225 GHz, respectively. To the best of the authors' knowledge, the proposed PA achieves the higher Psat and PAE value than other dual-band PA operating at frequencies greater than 100 GHz with silicon-based process.
引用
收藏
页码:768 / 773
页数:6
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