Monolithic full-color micro-LED displays featuring three-dimensional chip bonding and quantum dot-based color conversion layer

What we believe to be a novel fabrication process for monolithic full-color (RGB) micro-LED (mu LED) display technology, featuring three-dimensional (3D) and quantum dot (QD)-based color conversion layer, has been proposed. This method offers advantages such as a wide color gamut, high pixel density, high yield, and low cost. A 16 x 16 passive matrix (PM) RGB mu LED array, with a pitch size of 80 mu m and a pixel density of 328 pixels per inch (PPI), has been successfully realized using flip-chip bonding technology. When measuring the electroluminescence (EL) spectra of the green and red pixels with the addition of color filters, the color gamut can achieve a maximum of 124% of the National Television System Committee (NTSC) standard. Additionally, this process significantly reduces the risk of damage to the QD film during photolithography compared to using two different colored QDs for RGB mu LED arrays. The proposed manufacturing process shows considerable promise for commercialization.