Meeting Challenges of Advanced Packaging Designs with a Preimidized Polymer as Dielectric Material

被引：0

作者：

Malik, Sanjay ^{[1
]}

De, Binod ^{[1
]}

Dilocker, Stephanie ^{[1
]}

Sakamuri, Raj ^{[1
]}

Kotyk, Juliet ^{[1
]}

机构：

[1] FUIFILM Elect Mat USA Inc, North Kingstown, RI 02852 USA

来源：

JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY | 2024年 / 37卷 / 05期

关键词：

Preimidized polymer; Copper migration; Advanced packaging; Reliability;

D O I：

暂无

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

This paper describes performance characteristics of a photoimageable dielectric organic polymer. Dielectric material used in this study is a preimidized polyimide (PID). Preimidized polymer cured in the temperature range of 170 degrees C to 230 degrees C shows excellent thermal stability and stable thermomechanical properties in a broad cure temperature range compared to its precursor analog (polyamic acid; PAA). PID also demonstrates excellent adhesion on different substrate types. PID retains good peel strength on copper even after 96 hours of HAST. PID has excellent stability against ion migration under multiple reliability test conditions.

引用

页码：561 / 566

页数：6

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