Micro Solder Defect Inspection Using Infrared Sequence and Deep Learning Learning Omni-scale CNN
被引:0
作者:
Jiang, Ye
论文数: 0引用数: 0
h-index: 0
机构:
Huazhong Univ Sci & Technol, Sch Mech Sci & Engn, Wuhan, Peoples R ChinaHuazhong Univ Sci & Technol, Sch Mech Sci & Engn, Wuhan, Peoples R China
Jiang, Ye
[1
]
Liu, Zhiyong
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h-index: 0
机构:
Huazhong Univ Sci & Technol, Sch Mech Sci & Engn, Wuhan, Peoples R ChinaHuazhong Univ Sci & Technol, Sch Mech Sci & Engn, Wuhan, Peoples R China
Liu, Zhiyong
[1
]
Liao, Guanglan
论文数: 0引用数: 0
h-index: 0
机构:
Huazhong Univ Sci & Technol, Sch Mech Sci & Engn, Wuhan, Peoples R ChinaHuazhong Univ Sci & Technol, Sch Mech Sci & Engn, Wuhan, Peoples R China
Liao, Guanglan
[1
]
机构:
[1] Huazhong Univ Sci & Technol, Sch Mech Sci & Engn, Wuhan, Peoples R China
来源:
2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT
|
2023年
关键词:
Solder bump;
Infrared sequence;
Chip on board;
Defect detection;
Deep learning;
D O I:
10.1109/ICEPT59018.2023.10492135
中图分类号:
T [工业技术];
学科分类号:
08 ;
摘要:
The chip on PCBA is developing towards miniaturization and high density. It becomes more difficult to detect micro solder bump defects inside the electronic package and soldering defects cause 71% of electronic package problems. However, fault diagnosis in the industrial manufacturing scenario is more complex and diverse involving the detection and location of solder bump defects at the IC level. As an attractive option to package inspection, X-ray may seriously affect the service life of ICs. Our group proposed a nondestructive diagnosis method on the basis of active thermography. In the recorded thermal image, the solder ball was segmented for the classification analysis. Due to the large size of PCBA, the narrow gap laser is limited to industrial applications. Because of the inefficiency and low identification rate of current detection, here we propose a detection method using infrared thermal imaging and Omni-scale CNN deep learning algorithm. We take the real chip as the experimental target. The infrared thermal sequence is collected to analyze the temperature evolution of different defect types. We use the target region segmentation to extract features to distinguish the invisible solder defects in infrared images. With the hyperparameter optimization, the Omni-scale CNN classification model realizes efficient and highly accurate detection of different solder (400 mu m-500 mu m) defect types.
机构:
Jiangsu Normal Univ, Sch Mech Engn, Xuzhou 221116, Jiangsu, Peoples R ChinaJiangsu Normal Univ, Sch Mech Engn, Xuzhou 221116, Jiangsu, Peoples R China
Lu, Xiangning
He, Zhenzhi
论文数: 0引用数: 0
h-index: 0
机构:
Jiangsu Normal Univ, Sch Mech Engn, Xuzhou 221116, Jiangsu, Peoples R ChinaJiangsu Normal Univ, Sch Mech Engn, Xuzhou 221116, Jiangsu, Peoples R China
He, Zhenzhi
Su, Lei
论文数: 0引用数: 0
h-index: 0
机构:
Jiangnan Univ, Sch Mech Engn, Wuxi 214122, Peoples R ChinaJiangsu Normal Univ, Sch Mech Engn, Xuzhou 221116, Jiangsu, Peoples R China
Su, Lei
Fan, Mengying
论文数: 0引用数: 0
h-index: 0
机构:
Jiangsu Normal Univ, Sch Mech Engn, Xuzhou 221116, Jiangsu, Peoples R ChinaJiangsu Normal Univ, Sch Mech Engn, Xuzhou 221116, Jiangsu, Peoples R China
Fan, Mengying
Liu, Fan
论文数: 0引用数: 0
h-index: 0
机构:
Jiangsu Normal Univ, Sch Mech Engn, Xuzhou 221116, Jiangsu, Peoples R ChinaJiangsu Normal Univ, Sch Mech Engn, Xuzhou 221116, Jiangsu, Peoples R China
Liu, Fan
Liao, Guanglan
论文数: 0引用数: 0
h-index: 0
机构:
State Key Lab Digital Mfg Equipment & Technol, Wuhan 430074, Hubei, Peoples R ChinaJiangsu Normal Univ, Sch Mech Engn, Xuzhou 221116, Jiangsu, Peoples R China
Liao, Guanglan
Shi, Tielin
论文数: 0引用数: 0
h-index: 0
机构:
State Key Lab Digital Mfg Equipment & Technol, Wuhan 430074, Hubei, Peoples R ChinaJiangsu Normal Univ, Sch Mech Engn, Xuzhou 221116, Jiangsu, Peoples R China
机构:
Jiangsu Normal Univ, Sch Mech Engn, Xuzhou 221116, Jiangsu, Peoples R ChinaJiangsu Normal Univ, Sch Mech Engn, Xuzhou 221116, Jiangsu, Peoples R China
Lu, Xiangning
He, Zhenzhi
论文数: 0引用数: 0
h-index: 0
机构:
Jiangsu Normal Univ, Sch Mech Engn, Xuzhou 221116, Jiangsu, Peoples R ChinaJiangsu Normal Univ, Sch Mech Engn, Xuzhou 221116, Jiangsu, Peoples R China
He, Zhenzhi
Su, Lei
论文数: 0引用数: 0
h-index: 0
机构:
Jiangnan Univ, Sch Mech Engn, Wuxi 214122, Peoples R ChinaJiangsu Normal Univ, Sch Mech Engn, Xuzhou 221116, Jiangsu, Peoples R China
Su, Lei
Fan, Mengying
论文数: 0引用数: 0
h-index: 0
机构:
Jiangsu Normal Univ, Sch Mech Engn, Xuzhou 221116, Jiangsu, Peoples R ChinaJiangsu Normal Univ, Sch Mech Engn, Xuzhou 221116, Jiangsu, Peoples R China
Fan, Mengying
Liu, Fan
论文数: 0引用数: 0
h-index: 0
机构:
Jiangsu Normal Univ, Sch Mech Engn, Xuzhou 221116, Jiangsu, Peoples R ChinaJiangsu Normal Univ, Sch Mech Engn, Xuzhou 221116, Jiangsu, Peoples R China
Liu, Fan
Liao, Guanglan
论文数: 0引用数: 0
h-index: 0
机构:
State Key Lab Digital Mfg Equipment & Technol, Wuhan 430074, Hubei, Peoples R ChinaJiangsu Normal Univ, Sch Mech Engn, Xuzhou 221116, Jiangsu, Peoples R China
Liao, Guanglan
Shi, Tielin
论文数: 0引用数: 0
h-index: 0
机构:
State Key Lab Digital Mfg Equipment & Technol, Wuhan 430074, Hubei, Peoples R ChinaJiangsu Normal Univ, Sch Mech Engn, Xuzhou 221116, Jiangsu, Peoples R China