Towards efficient ESD protection strategies for advanced 3D systems-on-chip

被引：0
|
作者：
Shih-Hsiang (Shane) Lin [1 ]
Marko Simicic [1 ]
Nicolas Pantano [1 ]
机构：
[1] imec,
来源：
Nature Reviews Electrical Engineering | 2024年 / 1卷 / 7期
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D O I：
10.1038/s44287-024-00071-4
中图分类号：
学科分类号：
摘要：
2.5D/3D technologies require designers to reduce electrostatic discharge (ESD) protection of the internal I/O interfaces. To avoid over-design of ESD protection, designers require a more fundamental understanding of the ESD events that occur at this level. Here we present insights, practical guidelines and research directions for circuit designers and suppliers of bonding tools.
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页码：429 / 431
页数：2
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