Research Advance on Material Removal at Microscale towards Ultra-precision Manufacturing

被引：1
|
作者：
Chen L. [1 ]
Liu Y. [1 ]
Tang C. [1 ]
Jiang Y. [1 ]
Shi P. [1 ]
Qian L. [1 ]
机构：
[1] School of Mechanical Engineering, Southwest Jiaotong University, Chengdu
来源：
Jixie Gongcheng Xuebao/Journal of Mechanical Engineering | 2023年 / 59卷 / 23期
关键词：
chemical mechanical polishing; energy dissipation model; microscopic removal mechanism; scanning probe lithography; single-point diamond turning; ultra-precision manufacturing;
D O I：
10.3901/JME.2023.23.229
中图分类号：
学科分类号：
摘要：
Ultra-precision manufacturing has been as the competitive frontier for most of coastal countries and regions with the incremental demands for ultra-high precision surfaces and structures in the hi-tech industrializations such as ultra-large-scale integrated circuits, microelectromechanical systems, and precise optics. The essence of ultra-precision manufacturing is to fabricate ultra-high precision surface or structure through the controllable addition, migration, or removal of the microscopic materials. This study reviewed the latest advances of several types of ultra-precision manufacturing technologies such as single point diamond turning, scanning probe lithography, chemical mechanical polishing, and ultra-precision grinding, which normally remove the materials at micro-scale under contact state. After that, the effects of processing parameters, processing tools, processing environment, and physical and chemical characteristics of the processed materials themselves on the material removal at microscale were systematically summarized and the microscale removal models matched the different dominated mechanisms were reviewed. Final, the challenges that will be encountered in the future development of ultra-precision manufacturing to achieve the controlled material removal at the atomic scale were prospected. © 2023 Chinese Mechanical Engineering Society. All rights reserved.
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页码：229 / 264
页数：35
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