Total X-ray dose effect on graphene field effect transistor

被引:0
|
作者
Li Ji-Fang [1 ]
Guo Hong-Xia [2 ]
Ma Wu-Ying [2 ]
Song Hong-Jia [1 ]
Zhong Xiang-Li [1 ]
Li Yang-Fan [1 ]
Bai Ru-Xue [1 ]
Lu Xiao-Jie [1 ]
Zhang Feng-Qi [2 ]
机构
[1] Xiangtan Univ, Sch Mat Sci & Engn, Xiangtan 411105, Peoples R China
[2] Northwest Inst Nucl Technol, Xian 710024, Peoples R China
基金
中国国家自然科学基金;
关键词
graphene field effect transistor; X-ray irradiation; total-ionizing-dose effect;
D O I
10.7498/aps.73.20231829
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
In this paper, the total dose effects of graphene field-effect transistors (GFETs) with different structures and sizes are studied. The irradiation experiments are carried out by using the 10-keV X-ray irradiation platform with a dose rate of 200 rad(Si)/s. Positive gate bias (V-G = +1 V, V-D = V-S = 0 V) is used during irradiation. Using a semiconductor parameter analyzer, the transfer characteristic curves of top-gate GFET and back-gate GFET are obtained before and after irradiation. At the same time, the degradation condition of the dirac voltage V-Dirac and the carrier mobility mu are extracted from the transfer characteristic curve. The experimental results demonstrate that V-Dirac and carrier mobility mu degrade with dose increasing. The depletion of V-Dirac and carrier mobility mu are caused by the oxide trap charge generated in the gate oxygen layer during X-ray irradiation. Compared with the back-gate GFETs, the top-gate GFETs show more severely degrade V-Dirac and carrier mobility, therefore top-gate GFET is more sensitive to X-ray radiation at the same cumulative dose than back-gate GFET. The analysis shows that the degradation of top-gate GFET is mainly caused by the oxide trap charge. And in contrast to top-gate GFET, oxygen adsorption contributes to the irradiation process of back-gate GFET, which somewhat mitigates the effect of radiation damage. Furthermore, a comparison of electrical property deterioration of GFETs of varying sizes between the pre-irradiation and the post-irradiation is made. The back-gate GFET, which has a size of 50 mu mx50 mu m, and the top-gate GFET, which has a size of 200 mu mx200 mu m, are damaged most seriously. In the case of the top-gate GFET, the larger the radiation area, the more the generated oxide trap charges are and the more serious the damage. In contrast, the back-gate GFET has a larger oxygen adsorption area during irradiation and a more noticeable oxygen adsorption effect, which partially offsets the damage produced by irradiation. Finally, the oxide trap charge mechanism is simulated by using TCAD simulation tool. The TCAD simulation reveals that the trap charge at the interface between Al2O3 and graphene is mainly responsible for the degradation of top-gate GFET property, significantly affecting the investigation of the radiation effect and radiation reinforcement of GFETs.
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页数:7
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