Reliability of AC thick-film electroluminescent lamps

被引：0

作者：

Vlaskin, Vladimir ^{[1
]}

Vlaskina, Svetlana ^{[2
]}

Berezhinsky, Leonid ^{[1
]}

Svechnikov, Georgiy ^{[1
]}

机构：

[1] NAS Ukraine, Inst Semicond Phys, 41 Prospect Nauky, UA-03028 Kiev, Ukraine

[2] Dong Seoul Coll, Seongnam 461714, Gyunggi, South Korea

来源：

SEMICONDUCTOR PHYSICS QUANTUM ELECTRONICS & OPTOELECTRONICS | 2009年 / 12卷 / 02期

关键词：

electroluminescence; thick film; reliability; ZnS; lifetime;

D O I：

暂无

中图分类号：

O4 [物理学];

学科分类号：

0702 ;

摘要：

The reliability of AC thick-film EL devices has been studied. The AC thick - film EL devices were fabricated by Novatech Inc. using the industrial print screen technology. The analysis of reasons for failure has been proposed. The dependence of EL lamp parameters on physical properties of the device EL layers was found. Our analysis of the breakdown spot showed that improvement of reliability can be reached using the additional dielectric layer between the phosphor layer and transparent electrode, high concentration of phosphor powder 70 % and binder 30 %, balanced resistance between the electric circuit and EL lamp. The thickness of the phosphor layer was equal to H = (1 + root 3/2)D (hexagonal packing), where D is the mean diameter of phosphor particles. The reliability dependence of EL lamp on a water adsorption property of packaging material was revealed.

引用

页数：5

共 50 条

[1] THICK-FILM MATERIALS AND RELIABILITY
GRAVES, PW
ELECTRICAL COMMUNICATION, 1982, 57 (02): : 127 - 131
[2] Frequency analysis of thick-film electroluminescent (EL) lamp
Marí Soucase, B
Martínez-Máñez, R
Soto Camino, J
Garcia-Breijo, E
Gil Sánchez, L
Ibáñez Civera, J
Gadea Morant, E
Tormos Ferrando, A
2005 Spanish Conference on Electron Devices, Proceedings, 2005, : 309 - 310
[3] AC CONDUCTION IN THICK-FILM DIELECTRIC COMPOSITES
GOLONKA, LJ
NITSCH, K
THIN SOLID FILMS, 1981, 76 (04) : L25 - L26
[4] MATERIALS DEVELOPMENT IMPROVES THICK-FILM RELIABILITY
CUMMINS, R
ELECTRONIC ENGINEERING, 1973, 45 (540): : 61 - 61
[5] MODEL FOR RELIABILITY PREDICTION OF THICK-FILM RESISTORS
PRANCHOV, RB
CAMPBELL, DS
ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1984, 11 (02): : 185 - 190
[6] RELIABILITY OF THICK-FILM CONDUCTORS IN HUMID ENVIRONMENT
NAKADA, Y
AMERICAN CERAMIC SOCIETY BULLETIN, 1981, 60 (03): : 402 - 402
[7] HIGH-RELIABILITY POLYMER THICK-FILM
MARTIN, FW
SOLID STATE TECHNOLOGY, 1982, 25 (10) : 173 - &
[8] THICK-FILM CIRCUITS FOR HIGH-RELIABILITY APPLICATIONS
HODGKINSON, J
ELECTRONICS AND POWER, 1980, 26 (09): : 709 - 711
[9] HIGH-RELIABILITY THICK-FILM CAPACITOR DIELECTRICS
HUANG, C
BLESS, P
STEIN, SJ
AMERICAN CERAMIC SOCIETY BULLETIN, 1984, 63 (08): : 1008 - 1008
[10] Thick film electroluminescent lamps on ZnS, Cu base and their application in safety systems
Ciez, M
Porada, Z
SYSTEMS OF OPTICAL SECURITY 2003, 2004, 5566 : 228 - 233

← 1 2 3 4 5 →