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- [1] PROGRESS IN NON-DESTRUCTIVE EXAMINATION OF CERAMIC CHIP CAPACITORS AMERICAN CERAMIC SOCIETY BULLETIN, 1980, 59 (08): : 831 - 831
- [2] ELECTRICAL BREAKDOWN IN CERAMIC CHIP CAPACITORS AMERICAN CERAMIC SOCIETY BULLETIN, 1979, 58 (03): : 369 - 369
- [3] APPLICATION OF MULTILAYER CERAMIC CHIP CAPACITORS AMERICAN CERAMIC SOCIETY BULLETIN, 1971, 50 (09): : 805 - &
- [4] MECHANICAL-PROPERTIES OF CERAMIC CHIP CAPACITORS AMERICAN CERAMIC SOCIETY BULLETIN, 1980, 59 (08): : 831 - 831
- [5] Multilayer ceramic chip capacitors for bypassing and decoupling ELECTRONIC ENGINEERING, 1996, 68 (829): : 91 - &
- [6] MECHANICAL-PROPERTIES OF CERAMIC CHIP CAPACITORS AMERICAN CERAMIC SOCIETY BULLETIN, 1980, 59 (03): : 380 - 380
- [7] ACOUSTIC CHARACTERIZATION OF DEFECTS IN CERAMIC CHIP CAPACITORS AMERICAN CERAMIC SOCIETY BULLETIN, 1981, 60 (09): : 935 - 935
- [9] A TECHNIQUE FOR BONDING CHIP CAPACITORS TO CERAMIC SUBSTRATES AMERICAN CERAMIC SOCIETY BULLETIN, 1982, 61 (09): : 944 - 944