THICK-FILM MATERIALS FOR ELECTROOPTIC APPLICATIONS

被引：0
|
作者：
STEIN, SJ
机构：
来源：
AMERICAN CERAMIC SOCIETY BULLETIN | 1972年 / 51卷 / 04期
关键词：
D O I：
暂无
中图分类号：
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
引用
收藏
页码：358 / &
相关论文
共 50 条
  • [1] THICK-FILM MATERIALS FOR ELECTROOPTICAL APPLICATIONS
    BRYANT, DL
    STEIN, SJ
    AMERICAN CERAMIC SOCIETY BULLETIN, 1972, 51 (09): : 728 - &
  • [2] THICK-FILM MATERIALS
    SETTY, MS
    ELECTRONICS INFORMATION & PLANNING, 1981, 8 (06): : 436 - 438
  • [3] Thick-film piezoelectric materials for high temperature applications
    Beeby, SP
    Torah, RN
    Grabham, N
    Tudor, MJ
    White, NM
    FERROELECTRICS, 2004, 313 : 63 - 69
  • [4] THICK-FILM MATERIALS FOR HYBRIDS
    COLEMAN, M
    RADIO AND ELECTRONIC ENGINEER, 1982, 52 (05): : 227 - 234
  • [5] TRENDS IN THICK-FILM MATERIALS
    MONES, AH
    ROSENBERG, RM
    SOLID STATE TECHNOLOGY, 1976, 19 (10) : 47 - 49
  • [6] THICK-FILM MATERIALS AND RELIABILITY
    GRAVES, PW
    ELECTRICAL COMMUNICATION, 1982, 57 (02): : 127 - 131
  • [7] THICK-FILM MATERIALS AND TECHNIQUES.
    Ulrich, Donald R.
    Electronic Packaging and Production, 1974, 14 (07): : 276 - 285
  • [8] THICK-FILM TECHNOLOGY - AN INTRODUCTION TO THE MATERIALS
    LARRY, JR
    ROSENBERG, RM
    UHLER, RO
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1980, 3 (02): : 211 - 225
  • [9] AN OVERVIEW OF THICK-FILM HYBRID MATERIALS
    HOFFMAN, LC
    AMERICAN CERAMIC SOCIETY BULLETIN, 1984, 63 (04): : 572 - 576
  • [10] MATERIALS SCIENCE OF THICK-FILM TECHNOLOGY
    VEST, RW
    AMERICAN CERAMIC SOCIETY BULLETIN, 1986, 65 (04): : 631 - 636
12345