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- [7] Failure mechanism of smaller substrate bond pad size in flip chip technology IPFA 2004: PROCEEDINGS OF THE 11TH INTERNATIONAL SYMPOSIUM ON THE PHYSICAL & FAILURE ANALYSIS OF INTEGRATED CIRCUITS, 2004, : 235 - 238
- [8] THEORY OF ADHESION - MECHANISM OF BOND FAILURE AND MECHANISM OF BOND IMPROVEMENT .2. A PROPOSED MECHANISM OF BOND FAILURE ADHESIVES AGE, 1969, 12 (01): : 25 - &