MULTICHIP MODULES FOR HIGH-PERFORMANCE COMPUTER-APPLICATIONS

Multichip module packaging is evolving to become the dominant packaging approach for high performance computer applications in order to take full advantage of the improvements in speed and level of integration of advanced very-large-scale integrated circuits. This technology uses chip-on-board assembly on very high density interconnect and achieves reduced interconnect length and elimination of one packaging level. In this paper we present the development efforts at Microelectronics and Computer Technology Corporation in this area which include the following: wafer bumping, multilayer copper/polyimide interconnect, high I/O tape automated bonding, high density connector, and cooling technology.