ELECTRONIC PACKAGING EVOLUTION IN IBM

被引：23

作者：

SERAPHIM, DP ^{[1
]}

FEINBERG, I ^{[1
]}

机构：

[1] IBM CORP,E FISHKILL FACIL,GEN TECHNOL DIV LAB,E FISHKILL FACIL,HOPEWELL JUNCTION,NY 12533

来源：

关键词：

Compendex;

D O I：

10.1147/rd.255.0617

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

Electronics packaging

引用

页码：617 / 629

页数：13

共 35 条

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[2]

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[4]

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SUSKO, JR .

[6]

BLAKE BE, 1964, 2ND P INT C EL CONT, P531

[7] A MULTILAYER CERAMIC MULTICHIP MODULE [J].

BLODGETT, AJ .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1980, 3 (04) :634-637

[8]

CARICCHIO JJ, 1978, Patent No. 4076599

[9]

CARICCHIO JJ, 1975, Patent No. 3920526

[10]

CHELLIS L, 1970, Patent No. 3523037