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- [3] LOW DIELECTRIC MATERIAL FOR MULTILAYER PRINTED WIRING BOARDS IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1990, 13 (04): : 1115 - 1120
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- [6] MATHEMATICAL MODELING OF THE PARAMETERS OF ACCURACY MULTILAYER PRINTED WIRING BOARDS 2016 INTERNATIONAL CONFERENCE ON ACTUAL PROBLEMS OF ELECTRON DEVICES ENGINEERING (APEDE), VOL 2, 2016, : 191 - +
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- [8] THERMAL CHARACTERISTICS OF MULTILAYER PRINTED WIRING BOARDS DURING LAMINATION IEEE TRANSACTIONS ON ELECTRICAL INSULATION, 1975, 10 (03): : 98 - 101
- [9] KERIMID 601 POLYIMIDE RESIN FOR MULTILAYER PRINTED WIRING BOARDS. SAMPE Quarterly, 1974, 6 (01): : 33 - 39
- [10] Application of multiobjective optimization in selection of printed wiring boards IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2003, 26 (04): : 425 - 432