CAPCAL - A 3-D CAPACITANCE SOLVER FOR SUPPORT OF CAD SYSTEMS

被引：20
|
作者：
SEIDL, A
KLOSE, H
SVOBODA, M
OBERNDORFER, J
ROSNER, W
机构：
[1] FRAUNHOFER ARBEITSGRP INTEGRIERTE SCHALTUNGEN,D-8520 ERLANGEN,FED REP GER
[2] SOFTWARE CONSULTING & SYST ANAL,D-8000 MUNCHEN 90,FED REP GER
[3] SIEMENS AG,CORP RES,D-8000 MUNICH 83,FED REP GER
来源：
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS | 1988年 / 7卷 / 05期
关键词：
ELECTRIC FIELDS - Mathematical Models - INTEGRATED CIRCUITS; VLSI - Computer Aided Design - MATHEMATICAL TECHNIQUES - Finite Difference Method;
D O I：
10.1109/43.3192
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
A program package is presented named CAPCAL that provides a method for calculation of the 3-D electric field distribution due to multilayer metallization of advanced VLSI (very large-scale integration) integrated circuits. The underlying physics and numerical modeling techniques used by CAPCAL are described. The finite-difference method together with a multigrid solver is used to permit easy program handling and full portability. Example capacitance calculations are presented for structures typical of the wiring of a memory cell. The influence of the line spacing and the permittivity of the passivation layer on the parasitic capacitances are also investigated. The codes developed have been tested on various computers down to the size of a microcomputer, and thus can be installed on every system currently in use for CAD.
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页码：549 / 556
页数：8
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