MICRO-CORROSION OF AL-CU BONDING PADS

被引：28
|
作者：
THOMAS, S
BERG, HM
机构：
来源：
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1987年 / 10卷 / 02期
关键词：
D O I：
10.1109/TCHMT.1987.1134741
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：252 / 257
页数：6
相关论文
共 50 条
  • [1] Corrosion Mechanisms of Cu Wire Bonding on Al Pads
    Qin, Wentao
    Anderson, Tom
    Barrientos, Denise
    Anderson, Harold
    Chang, George
    2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018), 2018, : 1446 - 1454
  • [2] Ambiphilic Al-Cu Bonding
    Liu, Han-Ying
    Schwamm, Ryan J.
    Hill, Michael S.
    Mahon, Mary F.
    McMullin, Claire L.
    Rajabi, Nasir A.
    ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, 2021, 60 (26) : 14390 - 14393
  • [3] Characterization of Wafer Level Corrosion for Al-Cu Interconnects and Ni-Pd Pads
    Wai, Wan Tatt
    Khong, Yong Foo
    Asmahan, Ishak
    2017 IEEE 24TH INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA), 2017,
  • [4] PITTING CORROSION OF AL AND AL-CU BICRYSTALS
    YASUDA, M
    WEINBERG, F
    TROMANS, D
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1990, 137 (12) : 3716 - 3723
  • [5] Atomic bonding and properties of al-cu alloy with θ(Al2Cu)
    Gao, Yingjun
    Mo, Qifeng
    Luo, Zhirong
    Zhang, Lina
    Huang, Chuanggao
    JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (10) : 1801 - 1805
  • [6] Atomic bonding and properties of Al-Cu alloy with ϑ(Al2Cu)
    Yingjun Gao
    Qifeng Mo
    Zhirong Luo
    Lina Zhang
    Chuanggao Huang
    Journal of Electronic Materials, 2006, 35 : 1801 - 1805
  • [7] MECHANISM OF INTERGRANULAR CORROSION OF AL-CU ALLOYS
    GALVELE, JR
    DEMICHELI, SM
    CORROSION SCIENCE, 1970, 10 (11) : 795 - +
  • [8] Resistance to corrosion of Al-Cu alloy in biodiesel
    Silvina Roman, Alejandra
    Selene Barrientos, Mayla
    Angel Noceras, Miguel
    Marcela Mendez, Claudia
    Esther Ares, Alicia
    MATERIA-RIO DE JANEIRO, 2018, 23 (02):
  • [9] PITTING CORROSION OF AL AND AL-CU SINGLE-CRYSTALS
    YASUDA, M
    WEINBERG, F
    TROMANS, D
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1990, 137 (12) : 3708 - 3715
  • [10] OPTIMIZATION OF COPPER WIRE BONDING ON AL-CU METALLIZATION
    NGUYEN, LT
    MCDONALD, D
    DANKER, AR
    NG, P
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1995, 18 (02): : 423 - 429
12345