AUTOMATIC-CONTROL OF HUMAN THERMAL COMFORT BY A LIQUID-COOLED GARMENT

被引：11
|
作者：
KUZNETZ, LH
机构：
来源：
JOURNAL OF BIOMECHANICAL ENGINEERING-TRANSACTIONS OF THE ASME | 1980年 / 102卷 / 02期
关键词：
D O I：
10.1115/1.3138213
中图分类号：
Q6 [生物物理学];
学科分类号：
071011 ;
摘要：
引用
收藏
页码：155 / 161
页数：7
相关论文
共 50 条
  • [1] MODULAR LIQUID-COOLED HELMET LINER FOR THERMAL COMFORT
    WILLIAMS, BA
    SHITZER, A
    AEROSPACE MEDICINE, 1974, 45 (09): : 1030 - 1036
  • [2] Thermal management control strategy of liquid-cooled fuel cell vehicle
    Su, Chu-Qi
    Sun, Jing-Feng
    Meng, Guo-Dong
    Liu, Xun
    Wang, Yi-Ping
    ENERGY REPORTS, 2022, 8 : 141 - 153
  • [3] Model of human/liquid cooling garment interaction for space suit automatic thermal control
    Nyberg, KL
    Diller, KR
    Wissler, EH
    JOURNAL OF BIOMECHANICAL ENGINEERING-TRANSACTIONS OF THE ASME, 2001, 123 (01): : 114 - 120
  • [4] THERMAL MANAGEMENT OF AIR-COOLED AND LIQUID-COOLED MULTICHIP MODULES
    BARCOHEN, A
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1987, 10 (02): : 159 - 175
  • [5] Thermal Sensation Modeling and Experiments for Liquid-Cooled Garments
    Shu, Weicheng
    Fan, Yiwen
    Zhang, Xinfeng
    Wang, Jiawen
    Luo, Xiaobing
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2020, 10 (03): : 418 - 423
  • [6] Optimal thermal operation of liquid-cooled electronic chips
    Sharma, Chander Shekhar
    Zimmermann, Severin
    Tiwari, Manish K.
    Michel, Bruno
    Poulikakos, Dimos
    INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2012, 55 (7-8) : 1957 - 1969
  • [7] NUMERICAL SIMULATION OF THERMAL STRESS FOR A LIQUID-COOLED EXHAUST MANIFOLD
    Fu, Dong
    Huang, Dui
    Juma, Ahmed
    Schreiber, Curtis M.
    Wang, Xiuling
    Zhou, Chenn Q.
    IMECE 2008: HEAT TRANSFER, FLUID FLOWS, AND THERMAL SYSTEMS, VOL 10, PTS A-C, 2009, : 725 - 733
  • [8] Transient Thermal Simulation of Liquid-Cooled 3-D Circuits
    Fourmigue, Alain
    Beltrame, Giovanni
    Nicolescu, Gabriela
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2016, 6 (09): : 1349 - 1360
  • [9] A Semi-Analytical Thermal Modeling Framework for Liquid-Cooled ICs
    Sridhar, Arvind
    Sabry, Mohamed M.
    Atienza, David
    IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 2014, 33 (08) : 1145 - 1158
  • [10] Thermal Stress Analysis of Liquid-Cooled 3D-ICs
    Islam, Sakib
    Abdel-Motaleb, Ibrahim
    2020 IEEE INTERNATIONAL CONFERENCE ON ELECTRO INFORMATION TECHNOLOGY (EIT), 2020, : 132 - 135
12345