COMPUTER-CONTROLLED ULTRASONIC ADHESIVE BOND EVALUATION

被引：0
|
作者：
RAISCH, JW [1 ]
ROSE, JL [1 ]
机构：
[1] DREXEL UNIV,PHILADELPHIA,PA 19104
来源：
MATERIALS EVALUATION | 1979年 / 37卷 / 06期
关键词：
ADHESIVES - Bonding - DATA PROCESSING - Data Acquisition - METALS AND ALLOYS - Bonding;
D O I：
暂无
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
An inspection procedure for a metal-to-metal step-lap joint problem is presented. Rather than study the mechanics of bonding and the relationship of performance to many manufacturing and service variables, it is proposed to examine the potential of selected ultrasonic signal features and their ability to predict performance of an adhesively bonded structure. Emphasis is placed on studying the nondisbond problem. A completely automated data acquisition and analysis procedure is utilized in this study.
引用
收藏
页码：55 / 64
页数：10
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