共 15 条
- [1] FUNDAMENTAL-ASPECTS OF PULSATING CURRENT METAL ELECTRODEPOSITION .4. TAFEL EQUATION IN THE DEPOSITION OF METALS BY A PULSATING CURRENT SURFACE TECHNOLOGY, 1982, 15 (02): : 161 - 165
- [2] FUNDAMENTAL-ASPECTS OF PULSATING CURRENT METAL ELECTRODEPOSITION .1. THE EFFECT OF THE PULSATING CURRENT ON THE SURFACE-ROUGHNESS AND THE POROSITY OF METAL DEPOSITS SURFACE TECHNOLOGY, 1980, 11 (02): : 99 - 109
- [3] FUNDAMENTAL-ASPECTS OF PULSATING CURRENT METAL ELECTRODEPOSITION .6. THE COMPARISON OF ELECTRODE SURFACE ROUGHENING IN PULSATING CURRENT AND PERIODIC REVERSE CURRENT ELECTRODEPOSITION OF METALS SURFACE TECHNOLOGY, 1982, 17 (02): : 125 - 129
- [4] FUNDAMENTAL-ASPECTS OF PULSATING CURRENT METAL ELECTRODEPOSITION .2. THE COMPARISON OF CURRENT-DENSITY DISTRIBUTIONS IN PULSATING CURRENT AND PERIODIC REVERSE CURRENT ELECTRODEPOSITION OF METALS SURFACE TECHNOLOGY, 1983, 19 (02): : 181 - 185
- [5] FUNDAMENTAL-ASPECTS OF PULSATING CURRENT METAL ELECTRODEPOSITION .5. THE DETERMINATION OF THE OPTIMAL FREQUENCY-RANGE SURFACE TECHNOLOGY, 1982, 17 (01): : 3 - 9
- [6] FUNDAMENTAL-ASPECTS OF PULSATING CURRENT METAL ELECTRODEPOSITION .7. THE EFFECT OF PAUSE-TO-PULSE RATIO ON MICROTHROWING POWER OF METAL-DEPOSITION SURFACE TECHNOLOGY, 1984, 22 (02): : 155 - 158
- [7] FUNDAMENTAL-ASPECTS OF PULSATING CURRENT METAL ELECTRODEPOSITION .2. THE MECHANISM OF METAL-FILM FORMATION ON AN INERT ELECTRODE SURFACE TECHNOLOGY, 1980, 11 (02): : 111 - 116
- [8] FUNDAMENTAL-ASPECTS OF PULSATING CURRENT METAL ELECTRODEPOSITION .9. THE PREVENTION OF SPONGY DEPOSIT FORMATION ON INERT SUBSTRATES SURFACE TECHNOLOGY, 1984, 22 (02): : 159 - 164
- [10] FUNDAMENTAL-ASPECTS OF PLATING TECHNOLOGY .3. THE EFFECT OF ELECTRODEPOSITION FROM COMPLEX SALT-SOLUTIONS ON METAL DISTRIBUTION OVER MACROPROFILES SURFACE TECHNOLOGY, 1984, 22 (03): : 245 - 250