Recent progress in packaging of RF MEMS

被引：2
|
作者：
Seki, T [1 ]
机构：
[1] OMRON Corp, Adv Device Lab, Kyoto, Japan
来源：
2004 IEEE CSIC SYMPOSIUM, TECHNICAL DIGEST 2004: 26TH ANNIVERSARY: COMPOUNDING YOUR CHIPS IN MONTEREY | 2004年
关键词：
RF MEMS; wafer level packaging (WLP); frit glass;
D O I：
10.1109/CSICS.2004.1392547
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
RF MEMS devices utilized micromachining technologies offer a high performance to several RF applications. However packaging for devices have reduced performance problem when integrated to another RF devices. This paper will be reviewed the recent progress in Packaging of RF MEMS especially switching devices. And, a novel method of wafer level packaging for RF-MEMS switch will be described.
引用
收藏
页码：233 / 236
页数：4
相关论文
共 50 条
  • [21] Effects of Packaging on RF MEMS Switch's Return Loss
    Yang, Le
    Liao, Xiaoping
    MICRO AND NANO TECHNOLOGY: 1ST INTERNATIONAL CONFERENCE OF CHINESE SOCIETY OF MICRO/NANO TECHNOLOGY(CSMNT), 2009, 60-61 : 94 - 98
  • [22] Innovation ultra thin packaging for RF-MEMS devices
    Park, YK
    Kim, YK
    Kim, CJ
    Ju, BK
    Park, JO
    BOSTON TRANSDUCERS'03: DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2, 2003, : 903 - 906
  • [23] Characterization of quartz-based packaging for RF-MEMS
    Sordo, G.
    Faes, A.
    Resta, G.
    Iannacci, J.
    SMART SENSORS, ACTUATORS, AND MEMS VI, 2013, 8763
  • [24] Polarization Reconfigurable Antenna on RF-MEMS Packaging Platform
    Jung, Tony J.
    Hyun, Ik-Jae
    Kim, Jong-Man
    Baek, Chang-Wook
    Lim, Sungjoon
    APMC: 2009 ASIA PACIFIC MICROWAVE CONFERENCE, VOLS 1-5, 2009, : 579 - +
  • [25] Effect of Packaging on Dielectric Charging in RF MEMS Capacitive Switches
    Peng, Zhen
    Palego, Cristiano
    Hwang, James C. M.
    Moody, Cody
    Malczewski, Andrew
    Pillans, Brandon W.
    Forehand, David I.
    Goldsmith, Charles L.
    2009 IEEE/MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM, VOLS 1-3, 2009, : 1637 - +
  • [26] Analysis of RF MEMS switch packaging process for yield improvement
    Mercado, LL
    Kuo, SM
    Lee, TYT
    Lee, R
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2005, 28 (01): : 134 - 141
  • [27] A novel and efficient packaging technology for RF-MEMS devices
    Theunis, F.
    Lisec, T.
    Reinert, W.
    Bielen, J.
    Yang, D.
    de Jongh, M.
    Krusemann, P. V. E.
    57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 1239 - +
  • [28] Wafer level packaging of RF mems for flip chip assembly
    Wei, J
    Lok, BK
    Lim, PC
    Nai, ML
    Lu, HJ
    Lai, FK
    Wong, CK
    ELECTRONIC AND PHOTONIC PACKAGING, ELECTRICAL SYSTEMS AND PHOTONIC DESIGN AND NANOTECHNOLOGY - 2003, 2003, : 119 - 123
  • [29] Recent progress on RF superconducting cavities
    郝建奎
    赵夔
    中国物理C, 2009, 33 (10) : 930 - 934
  • [30] Recent progress on RF superconductivity and ERL
    Hao Jian-Kui
    Zhao Kui
    CHINESE PHYSICS C, 2008, 32 : 200 - 203
12345