SOI Technologies from Microelectronics to Microsystems - Meeting the More than Moore Roadmap Requirements -

被引:0
|
作者
Raskin, Jean-Pierre [1 ]
机构
[1] Catholic Univ Louvain, Inst Informat & Commun Technol Elect & Appl Math, B-1348 Louvain, Belgium
关键词
RF PERFORMANCE; RESISTIVITY; SENSORS;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This last decade Silicon-on-Insulator (SOI) MOSFET technology has demonstrated its potentialities for high frequency (reaching cut-off frequencies close to 500 GHz for nMOSFETs) and for harsh environments (high temperature, radiation) commercial applications. SOI also presents high resistivity substrate capabilities, leading to substantially reduced substrate losses. More recently, SOI technology has been emerging as a major contender for heterogeneous microsystems applications. In this work, we demonstrate the advantages of SOI technology for RF CMOS integration as well as for building thin film sensors on thin dielectric membrane and three-dimensional micro-electro-mechanical (MEMS) sensors and actuators co-integrated with their associated SOI CMOS circuitry.
引用
收藏
页码:144 / 147
页数:4
相关论文
共 33 条
  • [1] SOI Technologies from Microelectronics to Microsystems - Meeting the More than Moore Roadmap Requirements
    Raskin, Jean-Pierre
    MICROELECTRONICS TECHNOLOGY AND DEVICES - SBMICRO 2012, 2012, 49 (01): : 15 - 23
  • [3] Roadmap challenges - There is more than Moore
    van Roosmalen, AJ
    THERMAL AND MECHANICAL SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS, 2004, : 3 - 3
  • [4] Microelectronics for the Real World: "Moore" versus "More than Moore"
    Kent, John P.
    Prasad, Jagdish
    PROCEEDINGS OF THE IEEE 2008 CUSTOM INTEGRATED CIRCUITS CONFERENCE, 2008, : 395 - 402
  • [5] More Moore and More than Moore meeting for 3D
    Deleonibus, S.
    2015 30TH SYMPOSIUM ON MICROELECTRONICS TECHNOLOGY AND DEVICES (SBMICRO), 2015,
  • [6] ITRS 2010: A More-than-Moore Roadmap?
    Derbyshire, Katherine
    SOLID STATE TECHNOLOGY, 2011, 54 (03) : 7 - 7
  • [7] Heterogeneous Integration: The More-Than-Moore Path to Silicon Photonic Microsystems
    Fish, Gregory
    Fang, Alexander
    Smart Photonic and Optoelectronic Integrated Circuits XVII, 2015, 9366
  • [8] Key Enabling Processes for More-than-Moore Technologies
    Lindner, P.
    Glinsner, T.
    Uhrmann, T.
    Dragoi, V.
    Plach, T.
    Matthias, T.
    Pabo, E.
    Wimplinger, M.
    IEEE INTERNATIONAL SOI CONFERENCE, 2012,
  • [9] 3D System-on-Chip technologies for More than Moore systems
    Ramm, Peter
    Klumpp, Armin
    Weber, Josef
    Taklo, Maaike M. V.
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2010, 16 (07): : 1051 - 1055
  • [10] More-Than-Moore: 3D Heterogeneous Integration into CMOS Technologies
    Wang, Albert
    Chen, Qi
    Li, Cheng
    Lu, Fei
    Wang, Chenkun
    Zhang, Feilong
    Wang, X. Shawn
    Ng, Jimmy
    Xie, Ya-Hong
    Ma, Rui
    Wang, Li
    Lin, Lin
    2017 IEEE 12TH INTERNATIONAL CONFERENCE ON NANO/MICRO ENGINEERED AND MOLECULAR SYSTEMS (NEMS), 2017, : 1 - 4