Microstructure and Mechanical Properties of Ti/Cu/Fe Dissimilar Joints

被引:6
|
作者
Chu, Qiaoling [1 ]
Li, Yi [1 ]
Cao, Qilu [1 ]
Zhang, Min [1 ]
Li, Jihong [1 ]
Zhao, Pengkang [2 ]
Yan, Fuxue [1 ]
Luo, Hailong [3 ]
Wang, Xudong [4 ]
Yan, Cheng [5 ]
机构
[1] Xian Univ Technol, Sch Mat Sci & Engn, Xian 710048, Peoples R China
[2] Xian Univ Technol, Sch Mech & Instrument Engn, Xian 710048, Peoples R China
[3] Shaanxi Ruisen Metall Composite Mat Co Ltd, Xianyang 713199, Peoples R China
[4] Fugu Cty Xuli Mech & Elect Technol Co Ltd, Yulin 719499, Peoples R China
[5] Queensland Univ Technol QUT, Sci & Engn Fac, Sch Chem Phys & Mech Engn, Brisbane, Qld 4001, Australia
基金
中国国家自然科学基金;
关键词
intermetallics; microstructure; mechanical property; Ti/Cu/Fe trimetallic plate; ELECTRON-BEAM; COMPOSITE PLATE; WELDED-JOINTS; PURE TITANIUM; COPPER; INTERFACE;
D O I
10.1007/s11665-022-07445-5
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The weldability of Ti/Cu/Fe trimetallic butt welds explosively bonded was investigated using the samples of different groove dimensions. The results indicated that the Ti/Cu dissimilar welds are free from cracks, and similar phase constituents are observed at Ti weld metal/Cu base metal interfaces. Cu4Ti intermetallics are formed adjacent to the Cu matrix (Cu weld metal/base metal). CuTi intermetallics with columnar structure is perpendicular to the interface and grow into the Ti weld metal. CuTi2 intermetallics show wide distribution with different morphology. Severe cracks are observed at Cu weld metal/Fe weld metal interface, attributed to the significant difference in melting point and low mutual solid solution between Fe and Cu alloys. During the solidification, it is found that liquid Cu penetrates into and weakens Fe grain boundaries. Ti weld metal near Cu matrix has a high microhardness (340 similar to 420 HV0.1). The fractography of the tensile sample confirms the quasi-cleavage fracture at Ti weld metal/Cu weld metal interface and intergranular fracture in the Fe weld metal. Possible ways to improve the welding process are also proposed.
引用
收藏
页码:4846 / 4859
页数:14
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