共 50 条
- [41] MEMS packaging and microassembly challenges DESIGN, CHARACTERIZATION, AND PACKAGING FOR MEMS AND MICROELECTRONICS, 1999, 3893 : 22 - 25
- [42] Integration and packaging of MEMS relays DESIGN, TEST, INTEGRATION, AND PACKAGING OF MEMS/MOEMS, PROCEEDINGS, 2000, 4019 : 333 - 341
- [43] MEMS packaging and microassembly challenges DEVICE AND PROCESS TECHNOLOGIES FOR MEMS AND MICROELECTRONICS, 1999, 3892 : 22 - 25
- [44] MEMS packaging and microassembly challenges ELECTRONICS AND STRUCTURES FOR MEMS, 1999, 3891 : 22 - 25
- [45] Packaging of optical MEMS devices Low, Y.L. (YLL@lucent.com), 1600, American Society of Mechanical Engineers(ASME) (125):
- [46] MEMS and MOEMS packaging challenges JOURNAL OF MATERIALS PROCESSING & MANUFACTURING SCIENCE, 2000, 8 (04): : 361 - 379
- [47] The introduction of MEMS packaging technology PROCEEDINGS OF THE 4TH INTERNATIONAL SYMPOSIUM ON ELECTRONIC MATERIALS AND PACKAGING, 2002, : 300 - 306
- [48] MEMS packaging issues and materials 2000 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 2000, 4339 : 598 - 604
- [49] MultiChip Mems Sensor Packaging EMPC-2011: 18TH EUROPEAN MICROELECTRONICS & PACKAGING CONFERENCE, 2011,
- [50] Printing system for MEMS packaging RELIABILITY, TESTING AND CHARACTERIZATION OF MEMS/MOEMS, 2001, 4558 : 206 - 214