MEMS Packaging Solutions: Open New Markets

被引：0
|
作者：
Gilleo, Ken
机构：
来源：
Electronic Packaging and Production | 2000年 / 40卷 / 06期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
No abstract available
引用
收藏
页码：49 / 58
相关论文
共 50 条
  • [31] Long-term outlook for MEMS: New applications and markets
    Jeromski, G
    SOLID STATE TECHNOLOGY, 1999, 42 (07) : 62 - +
  • [32] CHALLANGES OF MARKETS - PACKAGING
    KALINA, J
    MODERN PLASTICS, 1971, 48 (10): : 86 - &
  • [33] PACKAGING FOR LIMITED MARKETS
    JORDAN, P
    SOAP COSMETICS CHEMICAL SPECIALTIES, 1981, 57 (03): : 52 - &
  • [34] Defence contracts to open up to new markets
    Murphy, James
    Jane's Defence Weekly, 2006, (MAY): : 379 - 380
  • [35] New solutions for high frequency electronic packaging
    Siebert, WP
    2003 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC), VOLS 1 AND 2, SYMPOSIUM RECORD, 2003, : 954 - 957
  • [36] UNCOOLED, CHEAP FLIRS TO OPEN NEW MARKETS
    KLASS, PJ
    AVIATION WEEK & SPACE TECHNOLOGY, 1994, 140 (09): : 61 - 61
  • [37] Diode lasers open doors in new markets
    Steele, RV
    LASER FOCUS WORLD, 2002, 38 (03): : S5 - S8
  • [38] Microwave Performance and Sensitivity Solutions for an Inline Coupling RF MEMS Power Sensor Packaging
    Zhang, Zhiqiang
    Liao, Xiaoping
    2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP), 2010, : 730 - 732
  • [39] A new methodology for comprehensive MEMS packaging for opto-electronic applications
    Keusseyan, R
    Speck, B
    Mobley, T
    2001 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 2001, 4587 : 639 - 644
  • [40] MEMS as low cost high volume semiconductor solutions it's all in the packaging and assembly
    Brown, Joe
    Lutz, Markus
    Partridge, Aaron
    Gupta, Pavan
    Radza, Eric
    RELIABILITY, PACKAGING, TESTING, AND CHARACTERIZATION OF MEMS/MOEMS VII, 2008, 6884
12345